As I can see you are the only single company which can do Reverse Engineering for Sauer DanFoss units. Sorry for my further technical question but it would be very good if you will give me any advises. I recently got Susmic21 unit for Reverse Engineering because it is my hobby. This unit is filled inside by special compound as you know. With help of dicloremetane for dissolving I took out internal PCB. But some ICs and other elements has became broken during extracting.
Could you give me any advises for extracting technology, type of solvent for compound or name of patent for compound?
Thank you in advance.